CAS.69731-45-9 1,3-Bis(oxiran-2-ylmethyl)-5-(prop-2-en-1-yl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione

As a thermosetting crosslinking node, the resin system is transformed from a liquid or thermoplastic state to a hard and durable thermosetting network structure through its highly reactive epoxy groups (and potential allyl groups). This compound is mainly used in fields that require extremely high heat resistance, electrical performance, and mechanical strength. In the plastic packaging materials and chip packaging adhesives of semiconductor components, isocyanuric acid can significantly improve the glass transition temperature, reflow soldering resistance, and low moisture absorption of the materials, ensuring the reliability of electronic devices in high temperature and high humidity environments.